TSMC is Reportedly Considering 3D DRAM Production

The world's largest chipmaker, TSMC, is reportedly considering entering the memory sector with the manufacturing of advanced DRAM technologies. According to a report from The Information, which cites sources close to the plans, TSMC is contemplating starting the production of 3D DRAM. As we know, there is a desperate need for more DRAM output from the three major memory makers: SK Hynix, Samsung, and Micron. New manufacturing capacity is being developed, but even when it comes online, there might still be a supply imbalance. According to The Information, TSMC is considering 3D DRAM manufacturing at the request of its largest customer, NVIDIA.

Conventional DRAM is currently produced by the big three, with plans to advance into 3D DRAM production beyond what HBM currently offers. To effectively scale memory, the 3D approach is the only way forward, as Micron recently confirmed. Micron has decided not to bring 4F² DRAM to market, even though it claims to have invented the cell design and has been researching it for around two decades, opting instead for the path to 3D DRAM. As one of the most experienced silicon manufacturers globally, TSMC is seemingly evaluating this path as well. Read full story